Line cards
SAMSUNG
1. DRAM Die
- DDR4 (K4A): K4A4G165WF-BCTD, K4A8G165WB-BCRC
- DDR5 (K4R): K4R80F08RB-BCF, K4R16F08RB-BCK
- LPDDR4X (K4E): K4E8E324EB-AGCF
- LPDDR5X (K4Z): K4Z80F08RB-BCK
- Legacy DDR3 (K4B): K4B4G1646Q-BCK0
2. Raw NAND Flash (K9)
K9CK8G08U0A, K9F8G08U0A
3. eMMC Embedded Flash (KLM)
KLM8G1GETF-B041, KLM32G1HEB-B041, KLM64G1HEB-B041
4. UFS High-speed Storage (KLU)
KLU8G1HEB-B0C1, KLU256Q1HC-B0D1
5. MCP Stacked Memory (KM)
KMQ8001QA-B041
6. DRAM Module SODIMM / UDIMM (M4)
M471A1K43BB1-CTD, M425R4GA3EB-CCP
7. SSD Drive (MZ)
- Client NVMe: MZVLB1T0HBL, MZVL2T0HBQ
- Enterprise Datacenter SSD: MZ1L996000
- SATA SSD: MZ-77E1T0
8. SPI NOR Flash (K6)
K6R4008V1B, K6R8008V1B
Quick Identification Rule
- K4A/K4R = DDR4/DDR5 discrete RAM chips
- K4E/K4Z = LPDDR low-power mobile DRAM
- K9 = Raw NAND Flash die
- KLM = eMMC embedded storage
- KLU = UFS high-speed mobile flash
- KM = MCP stacked DRAM+NAND
- M4 = Finished memory stick module
- MZ = Complete SSD solid state drive
MICRON
1. DRAM SDRAM
- DDR5 (MT60): MT60B256G32, MT60B512G32
- DDR4 (MT40): MT40A512M16, MT40A256M8
- LPDDR5/LPDDR4 (MT62 / MT52): MT62B256G32, MT52D256M32
- GDDR6/GDDR6X (MT61): MT61B256G32
- Legacy DDR3 (MT47), DDR2 (MT46), SDRAM (MT48)
2. 3D NAND Raw Die (MT29F)
MT29F128G08, MT29F256G08, MT29F512G08, MT29F1T08
3. eMMC / UFS Embedded Flash (MTFC)
eMMC: MTFC32GAPALBH, MTFC64GAPALBH UFS: MTFC256GAZAOTD, MTFC512GAZAOTD
4. SPI NOR Flash
- N25Q New Industrial Grade: N25Q064A, N25Q128A, N25Q256A
- M25 Legacy General NOR: M25P64, M25P128, M25Q256
5. Parallel NOR Flash (M29DW)
M29DW128G, M29DW256G
6. MCP Stacked Memory (MT38)
MT38W2033, MT38L0644
7. SSD Drive Series (No MT Prefix)
Datacenter SSD: 7450, 7500, 7600, 9550, 9650 Client SSD: 2500, 2650, 3610, 4600