Line cards

SAMSUNG

1. DRAM Die

  • DDR4 (K4A): K4A4G165WF-BCTD, K4A8G165WB-BCRC
  • DDR5 (K4R): K4R80F08RB-BCF, K4R16F08RB-BCK
  • LPDDR4X (K4E): K4E8E324EB-AGCF
  • LPDDR5X (K4Z): K4Z80F08RB-BCK
  • Legacy DDR3 (K4B): K4B4G1646Q-BCK0

2. Raw NAND Flash (K9)

K9CK8G08U0A, K9F8G08U0A

3. eMMC Embedded Flash (KLM)

KLM8G1GETF-B041, KLM32G1HEB-B041, KLM64G1HEB-B041

4. UFS High-speed Storage (KLU)

KLU8G1HEB-B0C1, KLU256Q1HC-B0D1

5. MCP Stacked Memory (KM)

KMQ8001QA-B041

6. DRAM Module SODIMM / UDIMM (M4)

M471A1K43BB1-CTD, M425R4GA3EB-CCP

7. SSD Drive (MZ)

  • Client NVMe: MZVLB1T0HBL, MZVL2T0HBQ
  • Enterprise Datacenter SSD: MZ1L996000
  • SATA SSD: MZ-77E1T0

8. SPI NOR Flash (K6)

K6R4008V1B, K6R8008V1B

Quick Identification Rule

  1. K4A/K4R = DDR4/DDR5 discrete RAM chips
  2. K4E/K4Z = LPDDR low-power mobile DRAM
  3. K9 = Raw NAND Flash die
  4. KLM = eMMC embedded storage
  5. KLU = UFS high-speed mobile flash
  6. KM = MCP stacked DRAM+NAND
  7. M4 = Finished memory stick module
  8. MZ = Complete SSD solid state drive

MICRON

1. DRAM SDRAM

  • DDR5 (MT60): MT60B256G32, MT60B512G32
  • DDR4 (MT40): MT40A512M16, MT40A256M8
  • LPDDR5/LPDDR4 (MT62 / MT52): MT62B256G32, MT52D256M32
  • GDDR6/GDDR6X (MT61): MT61B256G32
  • Legacy DDR3 (MT47), DDR2 (MT46), SDRAM (MT48)

2. 3D NAND Raw Die (MT29F)

MT29F128G08, MT29F256G08, MT29F512G08, MT29F1T08

3. eMMC / UFS Embedded Flash (MTFC)

eMMC: MTFC32GAPALBH, MTFC64GAPALBH UFS: MTFC256GAZAOTD, MTFC512GAZAOTD

4. SPI NOR Flash

  • N25Q New Industrial Grade: N25Q064A, N25Q128A, N25Q256A
  • M25 Legacy General NOR: M25P64, M25P128, M25Q256

5. Parallel NOR Flash (M29DW)

M29DW128G, M29DW256G

6. MCP Stacked Memory (MT38)

MT38W2033, MT38L0644

7. SSD Drive Series (No MT Prefix)

Datacenter SSD: 7450, 7500, 7600, 9550, 9650 Client SSD: 2500, 2650, 3610, 4600